As part of our ongoing improvements to the embedded module platform, our team has begun redesigning the original board into a much smaller and more efficient form. One of the biggest upgrades we’re implementing is the move to a double-sided PCB layout.
By placing components on both sides of the board, we’re able to:
- Significantly reduce the overall footprint
- Improve routing efficiency and shorten trace lengths
- Create a cleaner, more organized component layout
- Open up space for future module expansions and add-ons
This redesign makes the platform more practical for real-world IoT and sensing applications where size, cost, and flexibility matter.
The compact double-sided layout represents a major step forward in making the Conflō platform more professional, scalable, and production-ready. We’ll share more detailed progress as the board moves toward final routing and fabrication.
More updates to come!
